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2025.03.19
Management / IR
Notice Regarding Completion of Payment for Disposal of Treasury Stock as Granting of Shares through Employee Shareholding Association and Partial Forfeiture
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2025.03.04
R&D
Resonac Signs Patent License Agreement with Shimadzu Corporation
~Providing new metrics for microscopic measurement, contributing to analysis in the field of materials science~ -
2025.02.26
Other
Notice of Convocation of the 116th Ordinary General Meeting of Shareholders
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2025.02.13
Management / IR
Consolidated Financial Statements for the year ended December 31, 2024
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2025.02.13
Management / IR
Consolidated Financial Results, 2024: Presentation Material
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2025.03.19
Management / IR
Notice Regarding Completion of Payment for Disposal of Treasury Stock as Granting of Shares through Employee Shareholding Association and Partial Forfeiture
-
2025.02.13
Management / IR
Consolidated Financial Statements for the year ended December 31, 2024
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2025.02.13
Management / IR
Consolidated Financial Results, 2024: Presentation Material
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2025.02.13
Management / IR
【CEO Presentation Material】"Co-Creative Chemical Company" -Reforms toward global top-level functional chemical company-
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2025.02.13
Management / IR
Resonac Announces Difference between Performance Forecast and Results, Posting of an Extraordinary Loss
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2025.02.12
Business
Resonac Develops Low Thermal Expansion Copper-Clad Laminates for Next-Generation Semiconductor Packages through Simulation
~Resonac introduces a unique in-house system to visualize design guidelines for each material~ - 2025.02.05 Business Resonac Transfers Exhaust Gas Abatement Equipment Business in Japan and Taiwan
- 2025.02.04 Business 3M Joins the US-JOINT Consortium for Next-Generation Semiconductor Packaging
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2025.01.20
Business
Resonac Launces the Circular Business Model "CirculaC" for Used Plastics and Textiles
-A new brand expanding the "Circle of Circulation" toward a sustainable future- -
2024.12.10
Business
TOPPAN Joins the US-JOINT Consortium for Next-Generation Semiconductor Packaging
Strengthening technology development for package substrates, accelerating R&D by Japanese and American companies
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2025.03.04
R&D
Resonac Signs Patent License Agreement with Shimadzu Corporation
~Providing new metrics for microscopic measurement, contributing to analysis in the field of materials science~ -
2025.01.27
R&D
Resonac’s Technology for Directly Recycling Mixed Plastic Wastes into Basic Chemicals Selected for NEDO's Green Innovation Fund
~This technology is aimed at expanding and promoting the effective recycling of used plastics while switching the raw materials and manufacturing processes of basic chemicals, which are primarily derived from fossil resources~ -
2024.11.14
R&D
Resonac Develops AI-Powered Material Exploration Tool
-Discovering optimum composition of high-resolution resist polymers for semiconductor packaging in one-fifth the time of exploring with conventional methods- -
2024.08.20
R&D
Resonac Expands Participation in Enthought's MI Acceleration Program
-Aiming to deliver new products faster by improving the efficiency of materials development - -
2024.08.06
R&D
Resonac Accelerates Semiconductor Materials Development with AI-Based Cutting-Edge Simulation Technology
-First elucidation of the semiconductor substrate polishing mechanism using CMP slurry through calculations made 100,000 times faster yet with accuracy-
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2024.12.27
Sustainability
Resonac Holds Sustainability Meeting 2024
- CEO, CHRO, General Manager of Electronics Business Headquarters, CSuO, Outside Board Director Mr. Yasukawa, and CSO/CRO explain progress on reforms aimed at enhancing Resonac’s corporate value - -
2024.10.04
Sustainability
Ecosystem Conservation Activity Hub in Ibaraki Prefecture Recognized as a "Nature Coexistence Site" by the Ministry of the Environment
–Promoting biodiversity conservation activities in collaboration with NPOs and local communities to achieve the international "30by30" Goal – -
2024.09.11
Sustainability
Resonac Group Issues Integrated Report “RESONAC REPORT 2024”
̶Focusing on "Resonac's earning power"̶ -
2024.09.03
Sustainability
Resonac Group Participates in Nagano Prefecture's "Forest Foster Parent Promotion Project"
-Collaborating with the community to promote wide-ranging forest conservation activities including construction of walking trails and tree planting- -
2024.08.07
Sustainability
Resonac Commits to Biodiversity Conservation by Registering as a TNFD Adopter
―Accelerating initiatives under the new Environmental Policy of the Resonac Group―
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2025.02.26
Other
Notice of Convocation of the 116th Ordinary General Meeting of Shareholders
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2024.03.11
Other
Resonac Group Introduces Newly Designed Uniform Worldwide
~ Resonac decided on functions and design of new uniform by employee vote and hearing at 63 business bases inside and outside Japan ~ -
2024.02.26
Other
Notice of Convocation of the 115th Ordinary General Meeting of Shareholders
- 2023.12.01 Other About Receiving Statement of Objections from the European Commission
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2023.10.11
Other
Resonac Participates WIPO GREEN, a Global Platform for Environment-friendly Technologies
—Resonac accelerates co-creative innovation through registration of environmental technologies including those for plastic chemical recycling—
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"What is Resonac?" "What are the characteristics of Resonac?"
We report on the strategies and activities aimed at enhancing corporate value
With Resonac materials, we solve challenges in manufacturing and technical development
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The Resonac Official Account
